Mr. Arun Augustine

Asst.Professor

Education Summary

  • PhD. in Antimicrobial thin film coating (thesis submitted)
  • M. Tech. in Production Technology,Visvesvaraya Technological University Belagavi/Basaveshwar Engineering College, Bagalkot,Karnataka
  • P.G Diploma in welding Engineering, Annamalai University
  • B.Tech in Mechanical Engineering,Sree Narayana Guru College of Engg. &Technology

Employment History

  • Guest Lecturer in Mechanical Engineering Dept,Govt. Polytechnic College,Kasargod.
  • Guest Lecturer in Mechanical Engineering Dept,LBS College of Engineering,Kasargod.
  • Assistant Professor in Vimal Jyothi Engineering College Kannur

Publications

  • Arun Augustin, Udaya Bhat.K, K. Rajendra Udupa, Chitharanjan Hegde (2015). “Electron Microscopic Study of Nodules formed during Electrodeposition of Copper on Aluminium”. Materials Science Forum, Trans Tech Publications, vols. 830-83: pp 371- 374.
  • Arun Augustin, K. Rajendra Udupa, Udaya Bhat K. (2015), “Effect of Pre-Zinc Coating on the Properties and Structure of DC Magnetron Sputtered Copper Thin Film on Aluminium” American Journal of Materials Science, Scientific & Academic Publishing. vol. 5(3C): pp 58-61.
  • Komalakrishna H., Arun Augustin, Udaya Bhat K. (2015), “Electron Beam Deposition of Copper Thin Film on Aluminium Substrate and Its Characterization” American Journal of Materials Science, Scientific & Academic Publishing. vol. 5(3C): pp 58-61.
  • Arun Augustin, K. Rajendra Udupa, and Udaya Bhat (2016). "Crystallite size measurement and micro-strain analysis of electrodeposited copper thin film using Williamson-Hall method." Proceeding of International Conference on Condensed Matter and Applied Physics, AIP Publishing, Vol. 1728. No. 1.
  • Arun Augustin, Udupa, K.R. and Bhat, K.U. (2016). "Effect of coating current density on the wettability of electrodeposited copper thin film on aluminium substrate", Perspectives in Science Elsevier Publishing.
  • Arun Augustin, Huilgol, P., Udupa, K.R. and Bhat, U. (2016). "Effect of Current Density during Electrodeposition on Microstructure and Hardness of Textured Cu Coating in the Application of Antimicrobial Al Touch Surface." Journal of the Mechanical Behavior of Biomedical Materials, Elsevier Publishing 63, 352–360.

Conferences

  • Arun Augustin, Udaya Bhat K, K.Rajendra Udupa (2016), “Characterization of DC Magnetron Sputtered Antimicrobial Cu Thin Film on Aluminium Touch Surface” international conference on functional materials (ICFM 2016) at PSN College of Engineering and Technology, Tirunelveli, Tamilnadu on September 7-10,2016.
  • Arun Augustin, K. Rajendra Udupa and Udaya Bhat K. (2015), “Effect of coating current density on the wettability of electrodeposited copper thin film on aluminium substrate” International Conference on recent trends in Engineering and Material Sciences(ICEMS- 2016) at Jaipur University, Rajasthan on March 17-19,2016.
  • Arun Augustin, Udaya Bhat, K Rajendra Udupa. “Impact of Copper ions on E. coli; an Electron Microscopic Study.” International conference on advanced chemical engineering (ICACE 2015) at NITK Surathkal, on December 20-22, 2015.
  • Arun Augustin, K Rajendra Udupa, Udaya Bhat. “Doping effect of silver nanoparticles on the structure, properties and antimicrobial behaviour of copper thin film electrodeposited on the aluminium substrate.” 4 th Nano Today Conference by “elsevier” at Dubai, on December 06-10, 2015.
  • Liju Elias, Arun Augustin, Udaya Bhat and Chitharanjan Hegde A. “Magnetic field induced HER on Electrodeposited Ni-W Alloy.” 4 th Nano Today Conference by “elsevier” at Dubai, on December 06-10, 2015.
  • Arun Augustin, K Rajendra Udupa, Udaya Bhat. “Crystallite Size Measurement and Micro-strain Analysis of Electrodeposited Copper Thin Film Using Williamson-Hall Method.” International conference on condensed matter and applied physics (ICC2015) at Bikaner, on October 30-31, 2015.
  • Arun Augustin, K. Rajendra Udupa and Udaya Bhat K. (2015), “Effect of microstructure on the contact angle of antimicrobial copper thin film coatings” World congress on Microscopy: Instrumentation, Techniques and Applications in Life Science and Material Sciences (WCM-2015) at Mahatma Gandhi University Kottayam, Kerala on October 9-11, 2015.8. Arun Augustin, Udaya Bhat, K Rajendra Udupa and Chitharanjan Hegde A, “Electron Microscopic Study of Nodules formed during Electrodeposition of Copper on Aluminium” International Conference on Advanced Materials and Manufacturing Processes for Strategic Sectors (ICAMPS 2015) by “Indian Institute of Metals” at Trivandrum, on May 13-15, 2015.
  • Tarun Kumar, Jayalakshmi, Arun Augustin, Suma Bhat, Udaya Bhat K, “Copper coating on steel by friction surfacing” International Conference on Friction based Materials (ICFP-2014) by Indian Institute of Science Bangalore, on September 3-5, 2014, p-17.
  • Arun Augustin, Udaya Bhat and Rajendra Udupa, “Mechanical Characterization of Antimicrobial Copper Thin film on Alumiium Substrate” National conference on Futuristic Advancement in Mechanical Engineering (FAME-2K16) Thalasserry, Kerala on 8-9 August 2016.
  • Arun Augustin, K Rajendra Udupa and Udaya Bhat, “Effect of Ag nanoparticle on the microstructure of copper thin film”, Make in India: Role of Metals and Materials (MIRMM) by Dept of Metallurgical and Materials Engineering NITK Surathkal, October 30-31, 2015.
  • Jayalakshmi M., Arun Augustin, Udaya Bhat K., Ramachadra Bhat B. “Investigation of effect of sputtering power on coating characteristics of magnetron sputtered Ti films on glass substrate”, Make in India: Role of Metals and Materials (MIRMM) by Dept of Metallurgical and Materials Engineering NITK Surathkal, October 30-31, 2015.
  • Arun Augustin, K Rajendra Udupa and Udaya Bhat, “Effect of Pre-Zinc Coating on the Properties and Structure of DC Magnetron Sputtered Copper Thin Film on Aluminium”, National conference on Emerging Trend in Mechanical Engineering (eTIME-2015) by Dept. of Mechanical Engineering, St.Joseph Engineering College Mangalore, August 7-8, 2015.